public:it:semeconductor

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public:it:semeconductor [2023/02/23 16:07] – [Fabs issue] oakfirepublic:it:semeconductor [2023/02/23 16:33] (当前版本) – [半导体行业组成：] oakfire
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 ==== 半导体行业组成： ==== ==== 半导体行业组成： ====
   * Chip Intellectual Property (IP) Cores   * Chip Intellectual Property (IP) Cores
-    * {{:public:it:chip-ip-cores-2.png|}}+    * {{ :public:it:chip-ip-cores-2.webp |}}
   * Electronic Design Automation (EDA) Tools   * Electronic Design Automation (EDA) Tools
     * 该行业由三个美国供应商主导--Cadence、Mentor（现在是西门子的一部分）和Synopsys     * 该行业由三个美国供应商主导--Cadence、Mentor（现在是西门子的一部分）和Synopsys
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     * [[https://www.tsmc.com/english|TSMC]] 台积电 is the leader in logic, Samsung 三星 is second     * [[https://www.tsmc.com/english|TSMC]] 台积电 is the leader in logic, Samsung 三星 is second
     * Fabs are short for fabrication plants – the factory that makes chips     * Fabs are short for fabrication plants – the factory that makes chips
-    * Chips are probably the most complicated products ever manufactured.  The diagram below is a simplified version of the 1000+ steps it takes to make a chip：{{:public:it:chip-fab-steps-2.png|}}+    * Chips are probably the most complicated products ever manufactured.  The diagram below is a simplified version of the 1000+ steps it takes to make a chip：{{ :public:it:chip-fab-steps-2.webp |}}
   * Outsourced Semiconductor Assembly and Test (OSAT)   * Outsourced Semiconductor Assembly and Test (OSAT)
 ==== Fabs issue ==== ==== Fabs issue ====
  • public/it/semeconductor.1677139666.txt.gz
  • 最后更改: 2023/02/23 16:07
  • 由 oakfire